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MicroBase’s expertise in laser material processing and laser-LIGA technology has enabled MicroBase to offer its customers fast, reliable and low cost mass production turn-key solutions in 3C, medical and other industries looking for best micro system technology providers.

A. Laser Material Processing
Materials suitable for laser drilling include polyimide and other polymers.
 

Drilling
Hole drilling by laser ablation can achieve ultra high precision that other machining methods can not. Materials suitable for laser drilling include
polyimide and other polymers.

Cutting
Many materials can be cut in our laser machining facility.
Metals, polymers and ceramics can be cut with minimized heated affected zone, little thermal effects and high precision.

 
 
Grooving
With excimer laser ablation technology, 3D structures such as U grooves, V grooves and upside-down U grooves can be formed on various polymer materials with micron accuracy and submicron surface roughness. Because of the flexibility of the process, fast turn-around time can be achieved at lower cost.
 
     
Structuring
3D complex geometry or structure is also possible with excimer laser processing technology.
 
     
Welding
Micro laser welding enables joining of two similar or dissimilar metal or alloys with little thermal effects. High weld depth can also be achieved without damages to surrounding areas. The figure to the right shows final welded part of a metal plate and a mesh.
 
     
B. LASER-LIGA Micro System Engineering
Materials suitable for laser drilling include polyimide and other polymers.
Micro Metal Mesh / Nozzle Plate for
Micro Sprayers / Atomizers
Micro Needle Array for
Biomedical Applications
3D Structure for Inkjet Nozzle Plate
 
Microfluidic Channels
Ni Alloy Mesh / Nozzle Plate with
Gold Plating
 
 
LIGA technology that uses X-ray as lithography light source is a prohibitedly costly process. While ablation by excimer laser radiation can be successfullly used for microstructuring, the costs of production are still rather high due to the fact that laser processing is a serial process with low throughput. Cost reduction is possible by combining excimer laser micromachining with a replication process such as injection molding or hot embossing. This so-called 'Laser-LIGA' process is a variant of the LIGA technique using ablation of polymers and photoresists by UV excimer lasers as the structure-defining /patterning process step. Compared to deep x-ray lithography the surface quality of microstructures made by laser ablation is slightly poorer and the maximum aspect ratios (up to 10) are considerably lower too. However, Laser-LIGA offers more flexibility at much lower cost compared to x-ray LIGA or excimer laser machining processes. Almost any geometry can be realized, in many cases without a mask by direct structuring. Once the structures are defined, micro molds are fabricated by electroformed for injection molding, casting or embossing applications. This process is therefore suited to rapid prototyping as well as for large scale production of micro- scale devices such as micro lenses, microfluidic systems, micro-optical devices and bio/medical components.
 
   
 

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